Patent · US Active

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

US7638418B2 · kind B2 · utility

6Cited by

7References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Rainer Steiner · Regensburg, DE
Holger Woerner · Regensburg, DE

Key dates

Filing date	Feb 20, 2007
Grant date	Dec 29, 2009
Priority date	—
Expiry date	Sep 15, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.