Micromechanical device and method for producing a micromechanical device
US7647832B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2006 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Aug 15, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0264
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical device and a method for producing this device are provided, the device having a sensor pattern that includes a spring pattern and a seismic mass. The seismic mass may be connected to the substrate material via the spring pattern, and a clearance may be provided in a direction perpendicular to the major substrate plane between the spring pattern and the substrate material. Alternatively, the spring pattern and the seismic mass may have a common, essentially continuous, front side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.