Patent · US Active

Micromechanical device and method for producing a micromechanical device

US7647832B2 · kind B2 · utility

2Cited by
5References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 15, 2006
Grant dateJan 19, 2010
Priority date
Expiry dateAug 15, 2027

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B2201/0264
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A micromechanical device and a method for producing this device are provided, the device having a sensor pattern that includes a spring pattern and a seismic mass. The seismic mass may be connected to the substrate material via the spring pattern, and a clearance may be provided in a direction perpendicular to the major substrate plane between the spring pattern and the substrate material. Alternatively, the spring pattern and the seismic mass may have a common, essentially continuous, front side surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.