Integrated circuits; methods for manufacturing an integrated circuit; memory modules; computing systems
US7649779B2 · kind B2 · utility
12Cited by
4References
71Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 15, 2007 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | May 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B69/00
Abstract
Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.