Methods of and apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a wafer
US7662254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2007 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Jan 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32568
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Positional relationships are established in a process chamber. A base is configured with a lower electrode surface to support a wafer, and an upper electrode has a lower surface. A drive mounted on the base has a linkage connected to the upper electrode. A fixture placed on the lower surface moves into a desired orientation of the lower electrode. With the upper electrode loosely connected by the linkage to the drive, the fixture transfers the desired orientation to the upper electrode. The linkage is tightened to maintain the desired orientation, the fixture is removed and a process exclusion insert is mounted to the upper electrode. The drive moves the upper electrode and the insert to define an inactive process zone between the upper electrode and the wafer on the lower electrode to protect a central area of the wafer during etching of a wafer edge environ around the central area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.