Patent · US Active

Integrated circuit component with a surface-mount housing

US7663218B2 · kind B2 · utility

1Cited by

7References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Edward Fuergut · Nuremberg, DE
Simon Jerebic · Regensburg, DE
Hermann Vilsmeier · Regensburg, DE

Key dates

Filing date	Aug 16, 2007
Grant date	Feb 16, 2010
Priority date	—
Expiry date	Oct 24, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.