Oxidant and passivant composition and method for use in treating a microelectronic structure
US7670497B2 · kind B2 · utility
3Cited by
0References
1Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 6, 2007 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Aug 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02063
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition that may be used for cleaning a metal containing conductor layer, such as a copper containing conductor layer, within a microelectronic structure includes an aqueous acid, along with an oxidant material and a passivant material contained within the aqueous acid. The composition does not include an abrasive material. The composition is particularly useful for cleaning a residue from a copper containing conductor layer and an adjoining dielectric layer that provides an aperture for accessing the copper containing conductor layer within a microelectronic structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.