Patent · US Active

Enhanced process yield using a hot-spot library

US7673278B2 · kind B2 · utility

22Cited by
8References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 29, 2007
Grant dateMar 2, 2010
Priority date—
Expiry dateOct 8, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L22/20
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention provides apparatus and methods for processing substrates using a hot-spot library.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.