Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution
US7674394B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2007 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Jun 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3244
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of processing a workpiece in the chamber of a plasma reactor includes capacitively coupling plasma source power using a ceiling gas distribution plate as the electrode while inductively coupling plasma source power through the ceiling gas distribution plate, and flowing process gas through the gas distribution plate from a gas input to plural gas injection orifices, distributing the gas flow within the gas distribution plate through a succession of arcuate paths joined at respective junctions, dividing gas flow at each junction from a first respective one of said gas flow paths into a respective pair of said gas flow paths in opposite gas flow directions, and restricting the arcuate length of each of the arcuate paths to less than half-circles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.