Patent · US Active

MuGFET with increased thermal mass

US7678632B2 · kind B2 · utility

6Cited by
1References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 17, 2006
Grant dateMar 16, 2010
Priority date
Expiry dateJun 20, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D89/60
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Some embodiments discussed herein include a semiconductor having a source region, a drain region and an array of fins operatively coupled to a gate region controlling current flow through the fins between the source region and the drain region. The semiconductor also has at least one cooling element formed at least in part of a material having a heat capacity equal to or larger than the heat capacity of the material of the source region, drain region and array of fins, the cooling elements being in close vicinity to fins of the array of fins electrically isolated from the fins of the array, the source region and the drain region. Other embodiments are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.