Test structure for electromigration analysis and related method
US7683651B2 · kind B2 · utility
4Cited by
14References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 5, 2009 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jan 5, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2858
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test structure for electromigration and related method are disclosed. The test structure may include an array of a plurality of multilink test sets, each multilink test set including a plurality of metal lines positioned within a dielectric material and connected in a serial configuration; each multilink test set being connected in a parallel configuration with the other multilink test sets, the parallel configuration including a first electrical connection to a cathode end of a first metal line in each multilink test set and a second electrical connection to an anode end of a last metal line in each multilink test set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.