Patent · US Active

Chuck with integrated wafer support

US7688091B2 · kind B2 · utility

1Cited by

782References

19Claims

0Family size

Assignee

Cascade Microtech, Inc. · US

Inventors

Peter Andrews · Tigard, US
Brad Froemke · Portland, US
John Dunklee · Tigard, US

Key dates

Filing date	Mar 10, 2008
Grant date	Mar 30, 2010
Priority date	—
Expiry date	Mar 10, 2028

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2887
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An improved chuck with lift pins within a probe station. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.