Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7691680B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2008 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Apr 23, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.