Beng Chye Chew
12Patents
6h-index
8Co-inventors
51Inventor score
Filing activity: Feb 5, 2002 → Apr 23, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7309623B2 | Method of fabricating a stacked die in die BGA package | Electricity | 34 | Active |
| US7282390B2 | Stacked die-in-die BGA package with die having a recess | Electricity | 12 | Expired |
| US7344969B2 | Stacked die in die BGA package | Electricity | 8 | Expired |
| US7332819B2 | Stacked die in die BGA package | Electricity | 7 | Expired |
| US7332820B2 | Stacked die in die BGA package | Electricity | 7 | Expired |
| US7371608B2 | Method of fabricating a stacked die having a recess in a die BGA package | Electricity | 6 | Expired |
| US8373277B2 | Stacked die in die BGA package | Electricity | 4 | Active |
| US7799610B2 | Method of fabricating a stacked die having a recess in a die BGA package | Electricity | 4 | Active |
| US7358117B2 | Stacked die in die BGA package | Electricity | 3 | Active |
| US7575953B2 | Stacked die with a recess in a die BGA package | Electricity | 3 | Active |
| US7282392B2 | Method of fabricating a stacked die in die BGA package | Electricity | 3 | Active |
| US7691680B2 | Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.