Patent · US Active

Semiconductor device with semiconductor chip and method for producing it

US7705436B2 · kind B2 · utility

7Cited by

8References

37Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Alfred Haimerl · Sinzing, DE
Angela Kessler · Regensburg, DE
Michael Bauer · Nittendorf, DE
Wolfgang Schober · Amberg, DE

Key dates

Filing date	Aug 6, 2007
Grant date	Apr 27, 2010
Priority date	—
Expiry date	May 5, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.