Micro-electro-mechanical-system package and method for manufacturing the same
US7706149B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2008 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Oct 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.