Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof

US7709177B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Marie Angelopoulos · Briarcliff Manor, US
• Katherina Babich · Chappaqua, US
• Douglas Charles LaTulipe · Danbury, US
• Qinghuang Lin · Yorktown Heights, US
• David R. Medeiros · Dobbs Ferry, US
• Wayne M. Moreau · Wappingers Falls, US
• Karen E. Petrillo · Mahopac, US
• John P. Simons · Cold Spring, US

Key dates

• Filing date: Oct 2, 2007
• Grant date: May 4, 2010
• Expiry date: Oct 2, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S430/145
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Multilayered resist structures including bilayer and top surface imaging which utilize tuned underlayers functioning as ARCs, planarizing layers, and etch resistant hard masks whose properties such as optical, chemical and physical properties are tailored to give a multilayer resist structure exhibiting high resolution, residue free lithography and methods of preparing these materials.