Solder foil, semiconductor device and electronic device
US7722962B2 · kind B2 · utility
7Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2001 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Dec 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.