Device, method and program for inspecting microstructure
US7726190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2006 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Dec 3, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0842
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A speaker unit has a plurality of sound sources each outputting a sound wave. The compressional, sound wave output from the speaker unit arrives, or vibrates air, which moves a movable part of a three-axis acceleration sensor, or a microstructure of a chip to be tested TP. As the movable part thus moves, a value in resistance accordingly varies, and such variation is measured as based on an output voltage provided via a probe. A control unit determines a property of the three-axis acceleration sensor from a value in property as measured or measurement data. Furthermore, the plurality of sound sources can be spaced by a pitch of a predetermined value set as based on their difference in the distance to the movable part of the three-axis acceleration sensor and the wavelength of the test wave to apply a composite test wave to the movable part such that the composite sound wave's composite sound field is maximized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.