Composite board with semiconductor chips and plastic housing composition and method

US7732242B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Markus Brunnbauer · Lappersdorf, DE
• Jesus Mennen Belonio, Jr. · Germering, DE
• Edward Fuergut · Nuremberg, DE
• Thorsten Meyer · Regensburg, DE

Key dates

• Filing date: Feb 28, 2007
• Grant date: Jun 8, 2010
• Expiry date: Apr 11, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3511
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.