Patent · US Active

Etch singulated semiconductor package

US7732899B1 · kind B1 · utility

7Cited by

316References

20Claims

0Family size

Assignee

Amkor Technology, Inc. · US

Inventors

Christopher J. Berry · Aiken, US
Christopher M. Scanlan · Chandler, US
Faheem F. Faheem · Chandler, US

Key dates

Filing date	Feb 4, 2009
Grant date	Jun 8, 2010
Priority date	—
Expiry date	Feb 4, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In accordance with the present invention, there is provided various methods of simultaneously fabricating a plurality of semiconductor packages (e.g., cavity type semiconductor packages) wherein the singulation process is achieved using etching techniques as opposed to more conventional cutting techniques such as sawing or punching. Such etching techniques are inherently lower in cost and free from many of the defects induced by other cutting techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.