Patent · US Active

Integrated circuit package formation

US7741151B2 · kind B2 · utility

36Cited by

17References

20Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Craig Amrine · Tempe, US
William H. Lytle · Chandler, US

Key dates

Filing date	Nov 6, 2008
Grant date	Jun 22, 2010
Priority date	—
Expiry date	Dec 19, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19042
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Integrated circuit packages are formed from a panel where the panel is separated by laser cutting the panel. In some embodiments, the panel is attached to the carrier for the formation of interconnect layers on the panel. Afterwards, the panel is cut with a laser while on the carrier to separate the integrated circuit packages. A tape or other type of structure may be attached to the top of the packages after the laser cutting. The integrated circuit packages are removed from the carrier by releasing the adhesive and removing the integrated circuit packages with the tape. The packages are then removed from the tape.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.