Addressable hierarchical metal wire test methodology
US7749778B2 · kind B2 · utility
10Cited by
28References
1Claims
0Family size
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Key dates
| Filing date | Jan 3, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Dec 6, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/927
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of monitoring and testing electro-migration and time dependent dielectric breakdown includes forming an addressable wiring test array, which includes a plurality or horizontally disposed metal wiring and a plurality of segmented, vertically disposed probing wiring, performing a single row continuity/resistance check to determine which row of said metal wiring is open, performing a full serpentine continuity/resistance check, and determining a position of short defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.