Patent · US Expired

Semiconductor device having a sensor chip, and method for producing the same

US7749797B2 · kind B2 · utility

22Cited by

14References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Alfred Haimerl · Sinzing, DE
Angela Kessler · Regensburg, DE
Joachim Mahler · Regensburg, DE
Wolfgang Schober · Amberg, DE

Key dates

Filing date	Aug 18, 2005
Grant date	Jul 6, 2010
Priority date	—
Expiry date	Dec 14, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.