Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
US7749899B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Feb 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and systems for forming electrical interconnects through microelectronic workpieces are disclosed herein. One aspect of the invention is directed to a method of manufacturing an electrical interconnect in a microelectronic workpiece having a plurality of dies. Each die can include at least one terminal electrically coupled to an integrated circuit. The method can include forming a blind hole in a first side of the workpiece, and forming a vent in a second side of the workpiece in fluid communication with the blind hole. The method can further include moving, e.g., by sucking and/or wetting, electrically conductive material into at least a portion of the blind hole by drawing at least a partial vacuum in the vent. In one embodiment, the blind hole can extend through one of the terminals on the workpiece. In this embodiment, the electrically conductive material forms an interconnect that extends through the workpiece and is electrically coupled to the terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.