Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US7750449B2 · kind B2 · utility
6Cited by
73References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Nov 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.