Adjusting a spacing between a gas distribution member and a substrate support
US7754282B2 · kind B2 · utility
1Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2008 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Aug 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of adjusting a spacing between a gas distribution member and a substrate support includes forming a layer on a substrate disposed on the substrate support; measuring a thickness of the layer on the substrate; and calculating differences in thickness between a reference location on the substrate and a plurality of remaining locations on the substrate. The method further comprises computing spacing adjustment amounts for the remaining locations relative to the reference location based on the differences in thickness between the reference location and the remaining locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.