Millisecond annealing (DSA) edge protection
US7754518B2 · kind B2 · utility
15Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2008 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Sep 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/268
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to block at least a portion of the energy directed toward the substrate. The blocker prevents damage to the substrate from thermal stresses as the incident energy approaches an edge of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.