Patent · US Active

Method for production of a semiconductor component

US7757390B2 · kind B2 · utility

1Cited by

5References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Schneegans · Vaterstetten, DE
Karsten Guth · Soest, DE
Ivan Galesic · Regensburg, DE

Key dates

Filing date	Jun 7, 2007
Grant date	Jul 20, 2010
Priority date	—
Expiry date	Jul 4, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53178
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A bonding head includes a pressure plate to press a component (e.g., a semiconductor chip) onto a substrate. The pressure plate includes a holding surface configured to hold the component and to allow the component to be pressed uniformly onto the substrate, thus allowing a particularly reliable connection. The bonding head can further include an apparatus configured to vary the curvature of the holding surface of the pressure plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.