Ivan Galesic
6Patents
3h-index
11Co-inventors
46Inventor score
Filing activity: May 3, 2005 → Mar 8, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7511382B2 | Semiconductor chip arrangement and method | Electricity | 4 | Expired |
| US7874475B2 | Method for the planar joining of components of semiconductor devices and a diffusion joining structure | Electricity | 3 | Active |
| US8283756B2 | Electronic component with buffer layer | Electricity | 3 | Active |
| US7757390B2 | Method for production of a semiconductor component | Emerging Cross-Sectional Technologies | 1 | Active |
| US8187964B2 | Integrated circuit device and method | Electricity | 1 | Active |
| US8883268B2 | Method and device for producing a parylene coating | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.