Design-based method for grouping systematic defects in lithography pattern writing system
US7760347B2 · kind B2 · utility
12Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Jan 14, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/84
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.