Semiconductor device and process for manufacturing the same
US7776735B2 · kind B2 · utility
1Cited by
9References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Jul 21, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.