Membrane die attach circuit element package and method therefor
US7781852B1 · kind B1 · utility
24Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2006 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Oct 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A circuit element package has a substrate having a plurality of electrically conductive patterns, a die pad, and an access hole formed through the die pad and substrate. A plurality of leads is coupled to the substrate. A circuit element die is attached to the die pad wherein a first sensor port is positioned over the access hole. A die attach membrane is provided for attaching the circuit element die to the die pad. The die attach membrane allows the circuit element die to sense ambient while protecting the circuit element die from environmental damage. An encapsulant is used for covering portions of the circuit element die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.