Patent · US Active

Apparatus and method for connecting a component with a substrate

US7793819B2 · kind B2 · utility

3Cited by

9References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Karsten Guth · Soest, DE
Alfred Kemper · Warstein, DE
Roland Speckels · Kamen, DE

Key dates

Filing date	Mar 19, 2007
Grant date	Sep 14, 2010
Priority date	—
Expiry date	Aug 2, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12493
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.