Patent · US Active

Semiconductor module having discrete components and method for producing the same

US7795727B2 · kind B2 · utility

6Cited by

21References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Alfred Haimerl · Sinzing, DE
Angela Kessler · Regensburg, DE
Joachim Mahler · Regensburg, DE

Key dates

Filing date	Apr 5, 2007
Grant date	Sep 14, 2010
Priority date	—
Expiry date	Apr 11, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/049
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a semiconductor module comprising stacked discrete components and a method for producing the same. In one embodiment, the semiconductor module has a semiconductor chip arranged on a wiring substrate. The discrete components are arranged and wired on an intermediate carrier, which is electrically connected to the wiring substrate and/or the semiconductor chip. The wiring substrate carries the semiconductor chip, the semiconductor chip carries the intermediate carrier and the intermediate carrier carries the discrete components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.