Test structure for OPC-related shorts between lines in a semiconductor device

US7800106B2 · kind B2 · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• Frank Feustel · Dresden, DE
• Thomas Werner · Radebeul, DE
• Kai Frohberg · Meißen, DE

Key dates

• Filing date: May 11, 2007
• Grant date: Sep 21, 2010
• Expiry date: Apr 25, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

OPC results may be efficiently evaluated on the basis of a test structure containing a plurality of line features with opposing end portions. Thus, for different line parameters, the effect of OPC may be determined for a given critical tip-to-tip distance by determining the leakage behavior of the test assemblies, each having different design parameter values for line width and lateral distance between adjacent lines.