Patent · US Active

Semiconductor device with semiconductor device components embedded in a plastics composition

US7800241B2 · kind B2 · utility

1Cited by

5References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Thomas Bemmerl · Schwandorf, DE
Edward Fuergut · Nuremberg, DE

Key dates

Filing date	Jun 20, 2006
Grant date	Sep 21, 2010
Priority date	—
Expiry date	Jul 10, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/20751
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device with semiconductor device components embedded in a plastics composition is disclosed. In one embodiment, organosilicon and organometallic compounds are used for producing an adhesion promoter layer. The adhesion promoter layer on the surfaces of the semiconductor device components of a semiconductor device has a microporous morphology and has an average thickness D of between 5 nm≦D≦300 nm. In this case, the adhesion promoter layer has nanoscale ceramic grains applied wet-chemically.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.