Electronic assembly manufacturing method
US7802359B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2007 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Nov 2, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1116
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is described for manufacturing electronic assemblies (52). Electronic die (36) held in a plastic matrix (43) form a partially completed panel (35) of electronic assemblies (52). The panel (35) is adhesively mounted to a ceramic carrier (20) having multiple holes (22) there through. Conductive interconnects (38-1, 38-2, etc.) and other layers are applied to the panel, coupled to electrical contacts on the die (36) and external electrical contacts (39-1) for the panel (50). The panel (50) and the carrier (20) are separated and the panel singulated to release the finished electronic assemblies (52). Silicone is a preferred adhesive (27) and is dissolved using a non-polar solvent (70) that penetrates through the holes (22) in the carrier (20) to the adhesive (27). The adhesive (27) is preferentially applied using a transfer adhesive sandwich (24), that is, an adhesive layer (27) with removable plastic sheets (25, 26) on either side that can be peeled away from the adhesive (27). This facilitates handling and properly locating the adhesive (27) on the carrier (20) for efficient low cost manufacture of the assemblies (52).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.