Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same
US7810513B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Feb 12, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for preparing a substrate is provided. The apparatus includes a proximity head and a megasonic proximity head. The proximity head is configured to be applied to a substrate frontside and is capable of generating a preparation meniscus on the substrate frontside. The preparation meniscus includes a preparation chemistry that is configured to remove a material defined on the substrate frontside. The megasonic proximity head is configured to be applied to a substrate backside, and is capable of generating a coupling meniscus on the substrate backside. The megasonic proximity head is further capable of imparting megasonic energy to the coupling meniscus. The megasonic energy imparted to the coupling meniscus is configured to enhance a mass transport of the preparation chemistry through a material to be removed on the substrate frontside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.