Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials
US7811424B1 · kind B1 · utility
7Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2005 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Jul 13, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for processing a substrate is provided. The apparatus includes a plating head configured to plate a surface of the substrate with a layer of a material using a fluid meniscus between the plating head and a surface of the substrate. The apparatus also includes a fluid meniscus stabilizing apparatus configured to apply a pre-processing fluid to the surface of the substrate before the fluid meniscus is applied to the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.