Patent · US Active

Method for the simultaneous double-side grinding of a plurality of semiconductor wafers

US7815489B2 · kind B2 · utility

7Cited by

13References

24Claims

0Family size

Assignees

Siltronic AG · DE
Peter Wolters GmbH · DE

Inventors

Georg Pietsch · Burghausen, DE
Michael Kerstan · Burghausen, DE
Heiko aus dem Spring · Weilburg, DE

Key dates

Filing date	Jul 9, 2007
Grant date	Oct 19, 2010
Priority date	—
Expiry date	Jan 2, 2029

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/08
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling apparatus and is thereby moved on a cycloidal trajectory, wherein the semiconductor wafers are machined in material-removing fashion between two rotating working disks, wherein each working disk comprises a working layer containing bonded abrasive. The method according to the invention makes it possible, by means of specific kinematics, to produce extremely planar semiconductor wafers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.