Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

US7815968B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Gareth G. Hougham · Ossining, US
• Leena Paivikki Buchwalter · Hopewell Junction, US
• Stephen L. Buchwalter · Hopewell Junction, US
• Jon A. Casey · Poughkeepsie, US
• Claudius Feger · Rio de Janeiro, BR
• Matteo Flotta · Armonk, US
• Jeffrey D. Gelmore · Burlington, US
• Kathleen C. Hinge · Tarrytown, US
• Anurag Jain · Corning, US
• Sung Kwon Kang · Chappaqua, US
• John U. Knickerbocker · Wappingers Falls, US

Key dates

• Filing date: Oct 8, 2008
• Grant date: Oct 19, 2010
• Expiry date: Oct 18, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1554
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.