Patent · US Active

Bonding pad for contacting a device

US7816791B2 · kind B2 · utility

0Cited by

6References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Carsten Ahrens · Birkenfeld, DE
Sven Albers · Regensburg, DE
Klaus Gnannt · Stadtbergen, DE
Ulrich Krumbein · Rosenheim, DE
Gunther Mackh · Dresden, DE
Patrick Schelauske · Bergkirchen, DE
Berthold Schuderer · Regensburg, DE
Georg Seidemann · Landshut, DE

Key dates

Filing date	Sep 12, 2007
Grant date	Oct 19, 2010
Priority date	—
Expiry date	Nov 22, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.