Vacuum processing apparatus
US7828928B2 · kind B2 · utility
6Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2008 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Aug 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vacuum processing apparatus includes an outer chamber comprising a vacuum container, an inner chamber in which a plasma used for processing a wafer is generated, the inner chamber being detachably disposed inside of the outer chamber, a wafer holder on which the wafer is located is disposed inside of the inner chamber, and an exhausting device disposed below the wafer holder which exhausts the inside of the inner chamber. The inner chamber is sealed in air-tight manner with respect to a space between the inner chamber and the outer chamber while the space is maintained at a vacuum pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.