Electroplating an yttrium-containing coating on a chamber component
US7833401B2 · kind B2 · utility
5Cited by
88References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2007 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Nov 18, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12806
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.