Patent · US Active

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

US7834464B2 · kind B2 · utility

73Cited by

9References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Markus Brunnbauer · Lappersdorf, DE
Jens Pohl · San Luis Obispo, US

Key dates

Filing date	Oct 9, 2007
Grant date	Nov 16, 2010
Priority date	—
Expiry date	Nov 21, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1469
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.