Methods for making substrates and substrates formed therefrom
US7839001B2 · kind B2 · utility
9Cited by
23References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2009 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Aug 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2007
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for making substrates for use in optics, electronics, or opto-electronics. The method may include transferring a seed layer onto a receiving support and depositing a useful layer onto the seed layer. The thermal expansion coefficient of the receiving support may be identical to or slightly larger than the thermal expansion coefficient of the useful layer and the thermal expansion coefficient of the seed layer may be substantially equal to the thermal expansion coefficient of the receiving support. Preferably, the nucleation layer and the intermediate support have substantially the same chemical composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.