Patent · US Active

Method and system for reducing overlay errors within exposure fields by APC control strategies

US7842442B2 · kind B2 · utility

20Cited by

4References

19Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Rolf Seltmann · Dresden, DE
Bernd Schulz · Radebeul, DE
Fritjof Hempel · Rohrbach, DE
Uwe Schulze · Dresden, DE

Key dates

Filing date	Aug 22, 2007
Grant date	Nov 30, 2010
Priority date	—
Expiry date	Jul 11, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/70633
WIPO fieldOptics
WIPO sectorInstruments

Abstract

By taking into consideration tool-specific distortion signatures and reticle-specific placement characteristics in an alignment control system, the control quality of sophisticated APC strategies may be significantly enhanced. Respective correction data may be established on the basis of any combinations of tool/reticles and layers to be aligned to each other, which may modify the respective target values of alignment parameters used for controlling the alignment process on the basis of standard overlay measurement data obtained from dedicated overlay marks.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.