Patent · US Active

Semiconductor device having an adhesion promoting layer and method for producing it

US7843055B2 · kind B2 · utility

6Cited by

5References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Markus Brunnbauer · Lappersdorf, DE
Edward Fuergut · Nuremberg, DE
Joachim Mahler · Regensburg, DE

Key dates

Filing date	Apr 10, 2007
Grant date	Nov 30, 2010
Priority date	—
Expiry date	Dec 15, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S977/902
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device and a method for producing it is disclosed. In one embodiment, an adhesion-promoting layer having nanoparticles is arranged between a circuit carrier and a plastic housing composition for the purpose of enhanced adhesion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.