Multilayer inductor
US7843303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2008 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Dec 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49073
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer inductor is disclosed. The multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element. The spiral inductor element is coupled to the first inductor electrode by means of a through hole formed in the bottom magnetic layer and to the second inductor electrode by means of power conductive traces formed on side surfaces of the multilayer inductor. Flux density reducing layers may be inserted directly above the bottom magnetic layer and directly below the top magnetic layer. Signal/power conductive traces formed on side surfaces of the multilayer inductor provide signal/power …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.