Patent · US Active

Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips

US7851927B2 · kind B2 · utility

2Cited by

7References

34Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Khalil Hosseini · Weihmichl, DE
Alexander Koenigsberger · Regensburg, DE
Ralf Otremba · Kaufbeuren, DE
Klaus Schiess · Allensbach, DE

Key dates

Filing date	Jan 3, 2007
Grant date	Dec 14, 2010
Priority date	—
Expiry date	Jan 19, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component (1) has a semiconductor chip (5) and a semiconductor component carrier (3) with external connection strips (12, 13, 15). The semiconductor chip (5) has a first electrode (6) and a control electrode (7) on its top side (8) and a second electrode (9) on its rear side (10). The semiconductor chip (5) is fixed by its top side (8) in flip-chip arrangement (11) on a first and a second external connection strip (12, 13) for the first electrode (6) and the control electrode (7). The second electrode (9) is electrically connected to at least one third external connection strip (15) via a bonding tape (14).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.